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NXP USA Inc. LPC18S30FET256E
NXP USA Inc. LPC18S30FET256E NXP USA Inc. LPC18S30FET256E

LPC18S30FET256E

Manufacturer:

NXP USA Inc.

Product Number:

LPC18S30FET256E

Description:

ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz ROMless 256-LBGA (17x17)

Description:

ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz ROMless 256-LBGA (17x17)


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NXP USA Inc. LPC18S30FET256E information

Specifications
ACL Staticide Inc NXP USA Inc. LPC18S30FET256E technical specifications, attributes, parameters and parts with similar specifications to ACL Staticide Inc NXP USA Inc. LPC18S30FET256E
  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Supplier Device Package
    256-LBGA (17x17)
  • Base Product Number
    LPC18S30
  • RoHS Status
    ROHS3 Compliant
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • REACH Status
    REACH Unaffected
  • ECCN
    5A992C
  • HTSUS
    8542.31.0001
  • Standard Package
    90
  • Mfr
    NXP USA Inc.
  • Series
    LPC18xx
  • Package
    Tray
  • Product Status
    Active
  • Core Processor
    ARM® Cortex®-M3
  • Core Size
    32-Bit Single-Core
  • Speed
    180MHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
  • Peripherals
    Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Number of I/O
    164
  • Program Memory Size
    -
  • Program Memory Type
    ROMless
  • EEPROM Size
    -
  • RAM Size
    200K x 8
  • Voltage - Supply (Vcc/Vdd)
    2.2V ~ 3.6V
  • Data Converters
    A/D 8x10b; D/A 1x10b
  • Oscillator Type
    Internal
  • Operating Temperature
    -40°C ~ 85°C (TA)
Documents & Media

PCN Assembly/OriginLPC18/LPC43 Site Add 24/Feb/2022
PCN PackagingAll Dev Label Update 15/Dec/2020
NXP USA Inc. LPC18S30FET256E Relevant information

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