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SPAKXC309VF100A
SPAKXC309VF100A SPAKXC309VF100A

568-SPAKXC309VF100A

Manufacturer:

NXP Semiconductors

Product Number:

568-SPAKXC309VF100A

Description:

SPAKXC309VF100A Overview


The 196-LBGA package contains these electronic components.It is provided with a packaging way of Tray.In addition to meeting a wide range of requirements, it is a

Description:

SPAKXC309VF100A Overview


The 196-LBGA package contains these electronic components.It is provided with a packaging way of Tray.In addition to meeting a wide range of requirements, it is a member of Fixed Point.The device is attached in a way that faces Surface Mount.It is essential that -40°C~105°C TJ is kept at a temperature that ensures proper operation of the machine.As the name implies, the analog voltage range of 3.30V refers to the voltage that can be inserted or removed.As part of the DSP563xx series, this digital signal processor is included.The terminations for its uses are 196.3.3V is the supply voltage.Based on its base part number of SPAKXC309, many ralated parts can be found.Using 100MHz as its clock frequency, it operates.

SPAKXC309VF100A Features


Supplied in the 196-LBGA package

SPAKXC309VF100A Applications


There are a lot of NXP USA Inc. SPAKXC309VF100A DSP applications.

  • MP3 audio player
  • Geophysical processing
  • Scene analysis technology
  • Finite impulse response digital filters
  • Airplanes
  • Sound navigation and ranging systems
  • TVs
  • Audio synthesis
  • Automatic analysis system of EEG or ECG
  • Audio


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SPAKXC309VF100A information

Specifications
ACL Staticide Inc SPAKXC309VF100A technical specifications, attributes, parameters and parts with similar specifications to ACL Staticide Inc SPAKXC309VF100A
  • Type
    Parameter
  • Clock Frequency
    100MHz
  • Address Bus Width
    18
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    24
  • Voltage - I/O
    3.30V
  • Barrel Shifter
    YES
  • Internal Bus Architecture
    MULTIPLE
  • Non-Volatile Memory
    ROM (576B)
  • On Chip Data RAM
    24kB
  • Clock Rate
    100MHz
  • Height Seated (Max)
    1.6mm
  • Length
    15mm
  • Width
    15mm
  • RoHS Status
    Non-RoHS Compliant
  • Mounting Type
    Surface Mount
  • Package / Case
    196-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TJ
  • Packaging
    Tray
  • Published
    2005
  • Series
    DSP563xx
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    196
  • ECCN Code
    3A001.A.3
  • Type
    Fixed Point
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    220
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    SPAKXC309
  • JESD-30 Code
    S-PBGA-B196
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    3V
  • Interface
    Host Interface, SSI, SCI
SPAKXC309VF100A Relevant information

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