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XC7Z045-3FFG900E
XC7Z045-3FFG900E XC7Z045-3FFG900E

903-XC7Z045-3FFG900E

Manufacturer:

Xilinx

Product Number:

903-XC7Z045-3FFG900E

Description:

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Assigned with the pa

Description:

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq?-7000 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.A power supply with a 1V rating is recommended.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.As a result, there are 900 terminations in total, which does really benefit system on a chip.Search XC7Z045 for system on chips with similar specs and purposes.At 1GHz, the wireless SoC works.It uses ARM as its core architecture.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z045-3FFG900E System On Chip (SoC) applications.

  • Keyboard
  • Efficient hardware for training of neural networks
  • Central alarm system
  • Communication network-on-Chip (cNoC)
  • External USB hard disk/SSD
  • Robotics
  • Functional safety for critical applications in the aerospace
  • Industrial
  • Industrial sectors
  • Industrial automation devices


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XC7Z045-3FFG900E information

Specifications
ACL Staticide Inc XC7Z045-3FFG900E technical specifications, attributes, parameters and parts with similar specifications to ACL Staticide Inc XC7Z045-3FFG900E
  • Type
    Parameter
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Package / Case
    900-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    900
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    1GHz
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC7Z045
  • JESD-30 Code
    S-PBGA-B900
  • Operating Supply Voltage
    1V
  • Supply Voltage-Max (Vsup)
    1.05V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Memory Type
    ROMless
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -3
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 350K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    3.35mm
  • Length
    31mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
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