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MPC860TZQ66D4
MPC860TZQ66D4 MPC860TZQ66D4

568-MPC860TZQ66D4

Manufacturer:

NXP Semiconductors

Product Number:

568-MPC860TZQ66D4

Description:

MPC860TZQ66D4 Overview


The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. High reliability is achieved using advanced packaging method Tray. 1 Core

Datasheet:

MPC860TZQ66D4

Description:

MPC860TZQ66D4 Overview


The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. It is important to understand the operating temperature around 0°C~95°C TA. From the MPC8xx series. DRAM RAM controllers are used by this CPU. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. There is 3.3V I/O running on this CPU. In terms of uPs and uCs as well as peripheral ICs, this is a MICROPROCESSOR, RISC. You can search for variants of a microprocessor with MPC860. Overall, there are 357 terminations. With a 3.3V voltage supply, the part should be turned on and run. There are 32 bits in its architecture. The supply voltage should not exceed 3.465V. An example of a Microprocessors microprocessor can be found here. This CPU has a wide external data Bus width of 32. CPU microprocessors with a clock frequency of 50MHz are used. According to datasheets, the micro processor requires 3.3V power sources.

MPC860TZQ66D4 Features


32-Bit Structure

MPC860TZQ66D4 Applications


There are a lot of NXP USA Inc. MPC860TZQ66D4 Microprocessor applications.

  • Tape drives
  • Embedded gateways
  • Instrumentation and process control field
  • Information appliances (networking of household appliances)
  • Process control devices
  • Microwave ovens
  • Home video and audio
  • Heater/Fan
  • Smart instruments
  • Toasters


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MPC860TZQ66D4 information

Specifications
ACL Staticide Inc MPC860TZQ66D4 technical specifications, attributes, parameters and parts with similar specifications to ACL Staticide Inc MPC860TZQ66D4
  • Type
    Parameter
  • Factory Lead Time
    12 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    66MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
MPC860TZQ66D4 Relevant information

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