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MCIMX6D6AVT10ADR
MCIMX6D6AVT10ADR MCIMX6D6AVT10ADR

568-MCIMX6D6AVT10ADR

Manufacturer:

NXP Semiconductors

Product Number:

568-MCIMX6D6AVT10ADR

Description:

MCIMX6D6AVT10ADR Overview


With a packing size of 624-FBGA, FCBGA, this embedded microprocessor is ideal for international shipping. Using advanced packaging techniques Tape & Reel (TR

Description:

MCIMX6D6AVT10ADR Overview


With a packing size of 624-FBGA, FCBGA, this embedded microprocessor is ideal for international shipping. Using advanced packaging techniques Tape & Reel (TR), high reliability is ensured. CPUs have 2 Core 32-Bit cores/bus width. Understand how the operating temperature around -40°C~125°C TJ is determined. It comes from the i.MX6D series. ARM? Cortex?-A9 is the processor core of this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces to better serve its users. At 1.8V 2.5V 2.8V 3.3V, the CPU runs its I/O. There is MICROPROCESSOR, RISC MICROPROCESSOR, RISC in the uPs, uCs, or peripheral ICs categories. In total, 624 terminations have been made. This microprocessor has an architecture of 32 bits.

MCIMX6D6AVT10ADR Features


ARM? Cortex?-A9 Core
32-Bit Structure

MCIMX6D6AVT10ADR Applications


There are a lot of NXP USA Inc. MCIMX6D6AVT10ADR Microprocessor applications.

  • Fax machines
  • Information appliances (networking of household appliances)
  • Microwave ovens
  • Hard drives
  • Security systems
  • Laminators
  • 3D printers
  • Walkie talkies
  • Kindle
  • Guidance-GPS


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MCIMX6D6AVT10ADR information

Specifications
ACL Staticide Inc MCIMX6D6AVT10ADR technical specifications, attributes, parameters and parts with similar specifications to ACL Staticide Inc MCIMX6D6AVT10ADR
  • Type
    Parameter
  • Factory Lead Time
    15 Weeks
  • Package / Case
    624-FBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~125°C TJ
  • Packaging
    Tape & Reel (TR)
  • Published
    2002
  • Series
    i.MX6D
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    624
  • ECCN Code
    5A992
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    S-PBGA-B624
  • Speed
    1.0GHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor
    ARM® Cortex®-A9
  • Bit Size
    32
  • Boundary Scan
    YES
  • Low Power Mode
    NO
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    1.8V 2.5V 2.8V 3.3V
  • Ethernet
    10/100/1000Mbps (1)
  • Number of Cores/Bus Width
    2 Core 32-Bit
  • Graphics Acceleration
    Yes
  • RAM Controllers
    LPDDR2, LVDDR3, DDR3
  • USB
    USB 2.0 + PHY (4)
  • Additional Interfaces
    CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
  • Co-Processors/DSP
    Multimedia; NEON™ SIMD
  • Security Features
    ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Display & Interface Controllers
    Keypad, LCD
  • SATA
    SATA 3Gbps (1)
  • Height Seated (Max)
    2.16mm
  • Length
    21mm
  • RoHS Status
    ROHS3 Compliant
MCIMX6D6AVT10ADR Relevant information

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The following are some common countries' logistic time.