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XCZU19EG-2FFVD1760I
XCZU19EG-2FFVD1760I XCZU19EG-2FFVD1760I

903-XCZU19EG-2FFVD1760I

Product Number:

903-XCZU19EG-2FFVD1760I

Description:

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


This SoC is built on Quad ARM? Cortex?-A53 MP

Description:

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.Internally, this SoC design uses the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series in which this system on chip SoC falls under.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells.Housed in the state-of-art Tray package.308 I/Os in total are included in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU19EG-2FFVD1760I System On Chip (SoC) applications.

  • System-on-chip (SoC)
  • Body control module
  • Robotics
  • Cyberphysical system-on-chip
  • Sensor network-on-chip (sNoC)
  • Automated sorting equipment
  • Test and Measurement
  • Industrial AC-DC
  • Central alarm system
  • Microcontroller


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XCZU19EG-2FFVD1760I information

Specifications
ACL Staticide Inc XCZU19EG-2FFVD1760I technical specifications, attributes, parameters and parts with similar specifications to ACL Staticide Inc XCZU19EG-2FFVD1760I
  • Type
    Parameter
  • Factory Lead Time
    11 Weeks
  • Package / Case
    1760-BBGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale+™ MPSoC EG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    308
  • Speed
    533MHz, 600MHz, 1.3GHz
  • RAM Size
    256KB
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
  • RoHS Status
    ROHS3 Compliant
XCZU19EG-2FFVD1760I Relevant information

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